TE Connectivity 0.6mm Pitch 204 Way, Right Angle SMT Mount DDR3 DIMM Socket ,1.5 V
- RS-artikelnummer:
- 467-536
- Tillv. art.nr:
- 2013311-1
- Tillverkare / varumärke:
- TE Connectivity
Antal (1 fack med 100 enheter)*
1 929,37 kr
(exkl. moms)
2 411,71 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 05 februari 2026
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Bricka(or) | Per Bricka | Per enhet* |
|---|---|---|
| 1 + | 1 929,37 kr | 19,294 kr |
*vägledande pris
- RS-artikelnummer:
- 467-536
- Tillv. art.nr:
- 2013311-1
- Tillverkare / varumärke:
- TE Connectivity
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TE Connectivity | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mounting Type | Surface Mount | |
| SDRAM Type | DDR3 | |
| Voltage Rating | 1.5 V | |
| Välj alla | ||
|---|---|---|
Brand TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mounting Type Surface Mount | ||
SDRAM Type DDR3 | ||
Voltage Rating 1.5 V | ||
- COO (Country of Origin):
- CN
The TE Connectivity Semi-hard tray for sockets offers a robust solution for memory integration, ensuring secure assembly and optimal performance. Designed with precision, this innovative component features a right-angle orientation and an impressive stack height of 9.2 mm, making it ideal for space-constrained applications. Its dual-bay configuration and the integrated locking ejector mechanism contribute to seamless installation and operation in various electronic systems. Noteworthy for its compatibility, the product not only supports advanced memory applications but also adheres to essential industry standards, ensuring reliability and longevity. With a focus on high-quality materials and engineering, this component is built to withstand demanding environments while maintaining excellent functionality.
Perfectly designed for double data rate (DDR) memory applications
Offers high-temperature thermoplastic housing to resist thermal stress
Features robust tin-plated latches for enhanced durability
Ensures compatibility with various printed circuit boards for versatile use
Meets stringent UL flammability ratings for safety assurance
Low halogen content demonstrates commitment to environmental standards
Reflow solder capable to 245°C for flexible assembly processes
Packaging quantity of 20 allows for efficient inventory management
Offers high-temperature thermoplastic housing to resist thermal stress
Features robust tin-plated latches for enhanced durability
Ensures compatibility with various printed circuit boards for versatile use
Meets stringent UL flammability ratings for safety assurance
Low halogen content demonstrates commitment to environmental standards
Reflow solder capable to 245°C for flexible assembly processes
Packaging quantity of 20 allows for efficient inventory management
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