OIS-150-770-X-T EPIGAP OSA Photonics, OIS-150 770nm IR LED, 1206 SMD package
- RS-artikelnummer:
- 173-6294
- Tillv. art.nr:
- OIS-150-770-X-T
- Tillverkare / varumärke:
- EPIGAP OSA Photonics
Mängdrabatt möjlig
Antal (1 förpackning med 10 enheter)*
82,25 kr
(exkl. moms)
102,81 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
I lager
- 630 enhet(er) är redo att levereras
- Plus 10 enhet(er) är redo att levereras från en annan plats
- Dessutom levereras 1 200 enhet(er) från den 18 december 2025
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 10 - 90 | 8,225 kr | 82,25 kr |
| 100 - 240 | 7,997 kr | 79,97 kr |
| 250 - 490 | 7,762 kr | 77,62 kr |
| 500 - 990 | 7,515 kr | 75,15 kr |
| 1000 + | 7,302 kr | 73,02 kr |
*vägledande pris
- RS-artikelnummer:
- 173-6294
- Tillv. art.nr:
- OIS-150-770-X-T
- Tillverkare / varumärke:
- EPIGAP OSA Photonics
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | EPIGAP OSA Photonics | |
| Peak Wavelength | 770nm | |
| Package Type | 1206 | |
| Radiant Intensity | 2.8mW/sr | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 3.2 x 1.6 x 1.2mm | |
| Lens Shape | Square | |
| Series | OIS-150 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| Maximum Supply Voltage | 2V | |
| Välj alla | ||
|---|---|---|
Brand EPIGAP OSA Photonics | ||
Peak Wavelength 770nm | ||
Package Type 1206 | ||
Radiant Intensity 2.8mW/sr | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 3.2 x 1.6 x 1.2mm | ||
Lens Shape Square | ||
Series OIS-150 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
Maximum Supply Voltage 2V | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
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