OSA Opto Light has designed several PCB-based SMD-LED packages for various sizes, radiant characteristics and chip types. Almost all of our standard chips can be mounted in our SMD-packages. All devices can be characterized at 20mA, 2mA (low current) and under custom specific conditions. Most of them can be packaged tape-up and tape-down. The thermal resistance of the devices itself is about 150K/W (Kelvin/Watt), depending on chip technology a power dissipation up to 10mW can be realized.
package: 1515 size: 3.8mm x 3.8mm x 0.9mm view angle: 120° substrate: AlN Ceramic for High Power applications technology: GaP, AlInGaP, GaAlAs and InGaN soldering pads: silver plated suitable for all SMT assembly methods
