Infineon FP75R12N2T7B11BPSA1 3 Phase IGBT, 75 A 1200 V, 31-Pin Module, Chassis Mount
- RS-artikelnummer:
- 232-6716
- Tillv. art.nr:
- FP75R12N2T7B11BPSA1
- Tillverkare / varumärke:
- Infineon
Antal (1 fack med 10 enheter)*
12 989,07 kr
(exkl. moms)
16 236,34 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
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- Leverans från den 04 januari 2027
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Enheter | Per enhet | Per Bricka* |
|---|---|---|
| 10 + | 1 298,907 kr | 12 989,07 kr |
*vägledande pris
- RS-artikelnummer:
- 232-6716
- Tillv. art.nr:
- FP75R12N2T7B11BPSA1
- Tillverkare / varumärke:
- Infineon
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 75 A | |
| Maximum Collector Emitter Voltage | 1200 V | |
| Maximum Gate Emitter Voltage | ±20V | |
| Maximum Power Dissipation | 20 mW | |
| Number of Transistors | 7 | |
| Package Type | Module | |
| Configuration | 3 Phase | |
| Mounting Type | Chassis Mount | |
| Channel Type | N | |
| Pin Count | 31 | |
| Transistor Configuration | 3 Phase | |
| Välj alla | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 75 A | ||
Maximum Collector Emitter Voltage 1200 V | ||
Maximum Gate Emitter Voltage ±20V | ||
Maximum Power Dissipation 20 mW | ||
Number of Transistors 7 | ||
Package Type Module | ||
Configuration 3 Phase | ||
Mounting Type Chassis Mount | ||
Channel Type N | ||
Pin Count 31 | ||
Transistor Configuration 3 Phase | ||
The Infineon's EconoPIM 2, 75 A three phase PIM IGBT module comes with TRENCHSTOP IGBT7, Emitter Controlled 7 diode, NTC and PressFIT contact technology. The PIM (Power Integrated Modules) with integration of rectifier and brake chopper enables system cost savings. Potential applications include auxiliary inverters, motor drives and servo drives.
RoHS-compliant modules
Copper base plate for optimized heat spread
High power density
Copper base plate for optimized heat spread
High power density
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