Infineon FF1800R17IP5BPSA1 Dual IGBT, 1.8 kA 1700 V AG-PRIME3+
- RS-artikelnummer:
- 222-4791
- Tillv. art.nr:
- FF1800R17IP5BPSA1
- Tillverkare / varumärke:
- Infineon
Antal (1 fack med 2 enheter)*
15 064,45 kr
(exkl. moms)
18 830,562 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
I lager
- Dessutom levereras 4 enhet(er) från den 01 januari 2026
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Enheter | Per enhet | Per Bricka* |
|---|---|---|
| 2 + | 7 532,225 kr | 15 064,45 kr |
*vägledande pris
- RS-artikelnummer:
- 222-4791
- Tillv. art.nr:
- FF1800R17IP5BPSA1
- Tillverkare / varumärke:
- Infineon
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Infineon | |
| Maximum Continuous Collector Current | 1.8 kA | |
| Maximum Collector Emitter Voltage | 1700 V | |
| Maximum Gate Emitter Voltage | 20V | |
| Maximum Power Dissipation | 1.8 kW | |
| Package Type | AG-PRIME3+ | |
| Configuration | Dual | |
| Channel Type | N | |
| Transistor Configuration | Common Emitter | |
| Välj alla | ||
|---|---|---|
Brand Infineon | ||
Maximum Continuous Collector Current 1.8 kA | ||
Maximum Collector Emitter Voltage 1700 V | ||
Maximum Gate Emitter Voltage 20V | ||
Maximum Power Dissipation 1.8 kW | ||
Package Type AG-PRIME3+ | ||
Configuration Dual | ||
Channel Type N | ||
Transistor Configuration Common Emitter | ||
The Infineon PrimePACK™3+ 1700 V, 1800 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT soft switching interconnection technology, Emitter Controlled 5 diode and NTC. Also available with pre-applied Thermal Interface Material.
Extended operation temperature (Tvjop= 175°C)
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400
Output current increased by more than 25% in the same footprint
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Total losses reduced by up to 20%
Package with CTI > 400
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