Infineon 1ED3123MC12HXUMA1 MOSFET Gate Driver 2, 13.5 A 8-Pin 15 V, DSO
- RS-artikelnummer:
- 233-3476
- Tillv. art.nr:
- 1ED3123MC12HXUMA1
- Tillverkare / varumärke:
- Infineon
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63,95 kr
(exkl. moms)
79,938 kr
(inkl. moms)
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- Dessutom levereras 158 enhet(er) från den 29 december 2025
- Dessutom levereras 4 enhet(er) från den 29 december 2025
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 2 - 18 | 31,975 kr | 63,95 kr |
| 20 - 48 | 28,84 kr | 57,68 kr |
| 50 - 98 | 26,88 kr | 53,76 kr |
| 100 - 198 | 24,975 kr | 49,95 kr |
| 200 + | 23,07 kr | 46,14 kr |
*vägledande pris
- RS-artikelnummer:
- 233-3476
- Tillv. art.nr:
- 1ED3123MC12HXUMA1
- Tillverkare / varumärke:
- Infineon
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Output Current | 13.5A | |
| Pin Count | 8 | |
| Fall Time | 30ns | |
| Package Type | DSO | |
| Driver Type | MOSFET | |
| Number of Outputs | 2 | |
| Rise Time | 30ns | |
| Minimum Supply Voltage | 3V | |
| Maximum Supply Voltage | 15V | |
| Number of Drivers | 2 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Height | 2.65mm | |
| Series | 1ED3123MC12H | |
| Width | 6.4 mm | |
| Standards/Approvals | No | |
| Length | 7.5mm | |
| Mount Type | Surface | |
| Automotive Standard | No | |
| Välj alla | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Output Current 13.5A | ||
Pin Count 8 | ||
Fall Time 30ns | ||
Package Type DSO | ||
Driver Type MOSFET | ||
Number of Outputs 2 | ||
Rise Time 30ns | ||
Minimum Supply Voltage 3V | ||
Maximum Supply Voltage 15V | ||
Number of Drivers 2 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Height 2.65mm | ||
Series 1ED3123MC12H | ||
Width 6.4 mm | ||
Standards/Approvals No | ||
Length 7.5mm | ||
Mount Type Surface | ||
Automotive Standard No | ||
Infineon MOSFET Gate Driver, 13.5A Output Current, 3V Supply Voltage - 1ED3123MC12HXUMA1
This MOSFET gate driver is a high-performance component designed to manage signal conversions and drive MOSFETs effectively. Encased in a compact PG-DSO-8 package, it features impressive specifications such as a peak output current of 13.5A and a supply voltage range from 3V to 15V. The inclusion of advanced functionalities makes it suitable for various applications in automation and electrical engineering.
Features & Benefits
• Integrated undervoltage lockout for safe operation
• Fast rise and fall times improve switching efficiency
• Two separate outputs for flexible control configurations
• Accommodates high ambient temperatures for robust performance
Applications
• Used in AC and brushless DC motor drives
• Integrated within high voltage DC-DC converters
• Ideal for DC-AC inverter
• Effective in induction heating systems
• Suitable for commercial air conditioning systems
What makes the undervoltage lockout feature essential in operation?
The undervoltage lockout feature ensures that the gate driver operates only when the supply voltage is above set thresholds, preventing malfunction or damage due to inadequate power supply.
How does the active Miller clamp enhance performance during operation?
The active Miller clamp provides a low-impedance path to redirect Miller current, mitigating the risk of unintended turn-on of adjacent IGBTs, which is critical in preventing system failures.
What is the significance of the high common-mode transient immunity rating?
A common-mode transient immunity rating above 200 kV/μs indicates the device's robustness against voltage spikes, making it reliable in high-noise environments typical in industrial applications.
Can this driver be used with different types of MOSFETs?
Yes, it is compatible with Si, SiC MOSFETs, and various IGBTs, allowing versatility across different designs and applications.
How does the compact PG-DSO-8 package benefit installation?
The PG-DSO-8 package ensures a surface mount design, simplifying PCB layout and reducing space requirements, which is advantageous in high-density applications.