Alliance Memory NAND 64000 MB EMMC Flash Memory 153-Pin FBGA, ASFC64G31T5-51BIN
- RS-artikelnummer:
- 665-371
- Tillv. art.nr:
- ASFC64G31T5-51BIN
- Tillverkare / varumärke:
- Alliance Memory
Antal (1 enhet)*
245,06 kr
(exkl. moms)
306,32 kr
(inkl. moms)
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Enheter | Per enhet |
|---|---|
| 1 + | 245,06 kr |
*vägledande pris
- RS-artikelnummer:
- 665-371
- Tillv. art.nr:
- ASFC64G31T5-51BIN
- Tillverkare / varumärke:
- Alliance Memory
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Alliance Memory | |
| Memory Size | 64000MB | |
| Product Type | Flash Memory | |
| Interface Type | EMMC | |
| Package Type | FBGA | |
| Pin Count | 153 | |
| Organisation | 64G x 8 | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | JEDEC e·MMC 5.1 (JESD84-B51), RoHS | |
| Length | 13mm | |
| Width | 11.5 mm | |
| Height | 1.2mm | |
| Number of Bits per Word | 8 | |
| Automotive Standard | No | |
| Supply Current | 0.06mA | |
| Series | ASFC | |
| Välj alla | ||
|---|---|---|
Brand Alliance Memory | ||
Memory Size 64000MB | ||
Product Type Flash Memory | ||
Interface Type EMMC | ||
Package Type FBGA | ||
Pin Count 153 | ||
Organisation 64G x 8 | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Minimum Supply Voltage 1.7V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals JEDEC e·MMC 5.1 (JESD84-B51), RoHS | ||
Length 13mm | ||
Width 11.5 mm | ||
Height 1.2mm | ||
Number of Bits per Word 8 | ||
Automotive Standard No | ||
Supply Current 0.06mA | ||
Series ASFC | ||
- COO (ursprungsland):
- DE
The Alliance Memory 64GB eMMC in a 153-ball FBGA package is a managed non-volatile storage device consisting of an integrated MMC controller and NAND flash memory within a JEDEC-defined standard BGA package. It is specifically designed as a compact memory solution for data storage and boot media. Optimized for predominantly read operations with low power consumption, it utilizes 3D TLC NAND technology and offers an optional Enhanced mode (pSLC) configuration to meet higher industrial performance demands. The device also supports industrial temperature grade specifications
3D TLC NAND base technology
Boot Operation Mode and Alternative Boot Operation Mode
Replay Protected Memory Block (RPMB)
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