Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm
- RS-artikelnummer:
- 200-5494
- Tillv. art.nr:
- 35310100 BOP 10.1 S
- Tillverkare / varumärke:
- Bopla
2 I lager för avsändande samma dag
Lagt till varukorgen
Pris (ex. moms) Varje
196,93 kr
(exkl. moms)
246,16 kr
(inkl. moms)
| Enheter | Per unit |
| 1 - 9 | 196,93 kr |
| 10 - 24 | 189,25 kr |
| 25 + | 185,15 kr |
- RS-artikelnummer:
- 200-5494
- Tillv. art.nr:
- 35310100 BOP 10.1 S
- Tillverkare / varumärke:
- Bopla
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.
IP65 rating
UL 94 V0 Fire class
Design seal optional
UL 94 V0 Fire class
Design seal optional
Specifikationer
Attribute | Value |
|---|---|
| Type | Seal |
| Length | 291mm |
| For Use With | BoPad 10.1 Enclosures |
| Width | 204mm |
| Dimensions | 291 x 204 x 54.3mm |
| Height | 54mm |
| Series | BoLink |
- RS-artikelnummer:
- 200-5494
- Tillv. art.nr:
- 35310100 BOP 10.1 S
- Tillverkare / varumärke:
- Bopla