Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive

  • RS-artikelnummer 752-4890
  • Tillv. art.nr HF650P-0.001-01-00-104
  • Tillverkare / varumärke Bergquist
Datablad
Lagstiftning och ursprungsland
RoHS-Försäkran
COO (Country of Origin): US
Produktdetaljer

Hi-Flow 650P

Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.

Thermal Impedance: 0.20°C-in2/W (@25 psi)
150°C high temperature reliability
Natural tack one side for ease of assembly
Exceptional thermal performance in an insulated pad

Specifikationer
Attribute Value
Thickness 0.001in
Thermal Conductivity 1.5W/m·K
Material Hi-Flow 650P
Self-Adhesive Yes
Minimum Operating Temperature -40°C
Maximum Operating Temperature +150°C
Material Trade Name Hi-Flow 650P
Operating Temperature Range -40 → +150 °C
Tillfälligt slut i lager – restorder för leverans 2020-11-11
Pris (ex. moms) Each (In a Bag of 50)
19,983 kr
(exkl. moms)
24,979 kr
(inkl. moms)
Enheter
Per unit
Per Bag*
50 +
19,983 kr
999,15 kr
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