Thermal Interface Sheet, Gap Pad 5000S35, 5W/m·K, 8 x 4in 0.06in, Self-Adhesive

  • RS-artikelnummer 707-3395
  • Tillv. art.nr GP5000S35-0.060-02-0804
  • Tillverkare / varumärke Bergquist
Datablad
Lagstiftning och ursprungsland
RoHS-Försäkran
COO (Country of Origin): US
Produktdetaljer

Gap Pad® 5000S35

Electrical insulators and thermal conductors
Adapted for electrical insulation and as thermal joints on assemblies of components where the height varies
The material has excellent elasticity
The thicknesses available means that GAP Pads can be used when the texture of the surface varies
The Ultra Soft range has the same characteristics but is softer and more malleable

Specifikationer
Attribute Value
Dimensions 8 x 4in
Thickness 0.06in
Length 8in
Width 4in
Thermal Conductivity 5W/m·K
Material Gap Pad 5000S35
Self-Adhesive Yes
Minimum Operating Temperature -60°C
Maximum Operating Temperature +200°C
Hardness Shore OO 35
Material Trade Name Gap Pad 5000S35
Operating Temperature Range -60 → +200 °C
47 I lager för leverans inom 1 arbetsdagar
Pris (ex. moms) Each
1 486,43 kr
(exkl. moms)
1 858,04 kr
(inkl. moms)
Enheter
Per unit
1 - 9
1 486,43 kr
10 - 24
1 377,20 kr
25 - 49
1 300,60 kr
50 - 99
1 224,13 kr
100 +
1 183,23 kr
Related Products
Insulator sheets on which heat-emitting power semi-conductors can ...
Description:
Insulator sheets on which heat-emitting power semi-conductors can be mounted directly with complete safety.This material is specially reserved for applications in which pressure between the transistor and the radiator is low.Available in dry or self-adhesive models (SIL-Pad 900-S AC).
Phase change thermal Interface material with aluminium carrier ...
Description:
Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power ...
T-pli 200 Series™ is the premium gap filler. ...
Description:
T-pli 200 Series™ is the premium gap filler. Its unique blend of boron nitride and silicone produces Laird Technologies' highest performing interface pad.The exceptional combination of high thermal conductivity and compliancy generates unmatched thermal resistances in a gap filling interface ...
Sheets on which heat-emitting power semi-conductors can be ...
Description:
Sheets on which heat-emitting power semi-conductors can be mounted directly with complete safety.This material is specially reserved for applications in which pressure between the transistor and the radiator is low.Available in dry or self-adhesive model (SIL-Pad 800-S AC).