Thermal Interface Sheet, Hi-Flow 225F-AC, 1W/m·K, 11 x 12in 0.102mm, Self-Adhesive

  • RS-artikelnummer 127-041
  • Tillv. art.nr HF225FAC-0.004-AC-1112
  • Tillverkare / varumärke Bergquist
Datablad
Lagstiftning och ursprungsland
RoHS-Försäkran
COO (Country of Origin): US
Produktdetaljer

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

Specifikationer
Attribute Value
Dimensions 11 x 12in
Thickness 0.102mm
Length 11in
Width 12in
Thermal Conductivity 1W/m·K
Material Hi-Flow 225F-AC
Self-Adhesive Yes
Maximum Operating Temperature +120°C
Material Trade Name Hi-Flow 225F-AC
Operating Temperature Range Maximum of +120 °C
48 I lager för leverans inom 1 arbetsdagar
Pris (ex. moms) Each
663,25 kr
(exkl. moms)
829,06 kr
(inkl. moms)
Enheter
Per unit
1 - 24
663,25 kr
25 - 99
614,48 kr
100 - 249
546,17 kr
250 - 499
512,03 kr
500 +
500,65 kr
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