Non-Silicone Heat Transfer Compound (EN - SDS)

Datasheet HTC100T

Atlas

Thermally compound intended for use as thermal interface between processors and heatsink. High thermal performance : 0.32°C/W ( TO220 termal test @ 50 psi)Density (g/cc) : 2.1The compound requires pressure of assembly to cause flow.

Thermally compound intended for use as thermal interface

Non-Silicone Thermal Grease, 1.5W/m·K

In some applications, the GAP Pad exerts a pressure unable to cope with risks of deterioration. For other applications, it is impossible to apply due to inaccessibility. To solve these problems, Bergquist has created a "GAP Pad liquid", thermal filler ...

In some applications, the GAP Pad exerts a

Gap Filler 1000 Thermal Grease, 1W/m·K

RS PRO phase change materials are ideal for thermal management applications. Available in this range are phase change interface materials in sheets, resistor pads and as a dispensable paste.Phase change materials work because they change their state with changes in ...

RS PRO phase change materials are ideal for

Thermal Paste, 3.4W/m·K

Q-Pad Q2 insulators are made up of a 25 μm aluminium sheet, coated on both sides with a 65 μm thermo-conductive layer.Thermal conductors.They overcome problems associated with grease, including contamination of fusion welds and cleaning operations.Available in dry or self-adhesive ...

Enheter	Per unit
1 - 14	211,45 kr
15 - 39	203,03 kr
40 +	194,59 kr

Attribute	Value
Thermal Conductivity	0.9W/m·K
Maximum Operating Temperature	+130°C
Minimum Operating Temperature	-50°C
Pack Size	100mL
Operating Temperature Range	-50 → +130 °C
Physical State	Paste

Thermal Grease, 0.9W/m·K

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