- RS-artikelnummer:
- 767-9054
- Tillv. art.nr:
- SEAM-50-03.5-S-10-2-A-K-TR
- Tillverkare / varumärke:
- Samtec
Tillfälligt slut i lager – restorder för leverans när den finns i lager
Lagt till varukorgen
Pris (ex. moms) Varje
171,49 kr
(exkl. moms)
214,36 kr
(inkl. moms)
Enheter | Per unit |
1 + | 171,49 kr |
- RS-artikelnummer:
- 767-9054
- Tillv. art.nr:
- SEAM-50-03.5-S-10-2-A-K-TR
- Tillverkare / varumärke:
- Samtec
Lagstiftning och ursprungsland
Produktdetaljer
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Specifikationer
Attribute | Value |
---|---|
Series | SEARAY SEAM |
Pitch | 1.27mm |
Body Orientation | Straight |
Connector System | Board to Board |
Mounting Type | Surface Mount |
Termination Method | Solder |
Contact Material | Copper Alloy |
Contact Plating | Gold |