Samtec SEARAY SEAM, 1.27mm Pitch, 500 Way, 10 Row, Vertical Header, Surface Mount

  • RS-artikelnummer 159-0583
  • Tillv. art.nr SEAM-50-02.0-S-10-2-A-K-TR
  • Tillverkare / varumärke Samtec
Datablad
Lagstiftning och ursprungsland
RoHS-Försäkran
Produktdetaljer

1.27mm SEARAY™ Series Interconnects

SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.

Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution

Specifikationer
Attribute Value
Series SEARAY SEAM
Pitch 1.27mm
Number of Contacts 500
Number of Rows 10
Body Orientation Vertical
Shrouded/Unshrouded Shrouded
Mounting Type Surface Mount
Connector System Board to Board
Termination Method Solder
Contact Plating Gold
Contact Material Copper Alloy
Current Rating 1.8A
4 I lager för leverans inom 1 arbetsdagar
Pris (ex. moms) Each
416,60 kr
(exkl. moms)
520,75 kr
(inkl. moms)
Enheter
Per unit
1 - 9
416,60 kr
10 - 24
354,04 kr
25 - 49
312,47 kr
50 +
270,70 kr
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