Samtec SEARAY SEAM, 1.27mm Pitch, 500 Way, 10 Row, Vertical Header, Surface Mount
- RS-artikelnummer 159-0583
- Tillv. art.nr SEAM-50-02.0-S-10-2-A-K-TR
- Tillverkare / varumärke Samtec
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal
Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
| Attribute | Value |
|---|---|
| Series | SEARAY SEAM |
| Pitch | 1.27mm |
| Number of Contacts | 500 |
| Number of Rows | 10 |
| Body Orientation | Vertical |
| Shrouded/Unshrouded | Shrouded |
| Mounting Type | Surface Mount |
| Connector System | Board to Board |
| Termination Method | Solder |
| Contact Plating | Gold |
| Contact Material | Copper Alloy |
| Current Rating | 1.8A |
