TE Connectivity IFP/LEC Assembly for use with Intel® Xeon® Phi™ Processor 7200F

Internal copper cable solution for use with Intel® Xeon® Phi™ Processor 7200F Series with integrated Intel® Omni-Path Architecture
Supports 25Gbps channel speeds utilizing Intel Omni-Path Architecture
Enables less expensive PCB material and electronics, with higher channel performance
Optimized construction to minimize insertion loss and cross talk
High density 0.7 mm LEC contact pitch
30AWG 85 Ohm low loss 25GHz primary pairs
Toolless connector insertion and extraction
Molded plastic strain-relief isolates solder joints from external stresses
Straight, left-turn or right-turn exit LEC termination support different system designs
Active press to release stainless steel IFT latching
Torsional spring latch LEC termination connects to retention features on socket bolster plate
Applications
High performance computing
Servers and routers
Data Center and Enterprise networks