- RS-artikelnummer:
- 179-5244
- Tillv. art.nr:
- CGA2B2X8R1H221K050BD
- Tillverkare / varumärke:
- TDK
Denna produkt har utgått
- RS-artikelnummer:
- 179-5244
- Tillv. art.nr:
- CGA2B2X8R1H221K050BD
- Tillverkare / varumärke:
- TDK
Datablad
Lagstiftning och ursprungsland
- COO (Country of Origin):
- JP
Produktdetaljer
Features
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical and thermal strength when use with conductive glue.
Design
Applications
Transmission control
Engine sensor module
Automotive power train ABS
Application requiring conductive glue mounting Method
AgPdCu termination for conductive glue mounting
Reduce risk of silver migration
Improved mechanical and thermal strength when use with conductive glue.
Design
Applications
Transmission control
Engine sensor module
Automotive power train ABS
Application requiring conductive glue mounting Method
Specifikationer
Attribute | Value |
---|---|
Capacitance | 220pF |
Voltage | 50V dc |
Package/Case | 0402 (1005M) |
Mounting Type | Surface Mount |
Dielectric | X8R |
Tolerance | ±10% |
Dimensions | 1 x 0.5 x 0.5mm |
Length | 1mm |
Automotive Standard | AEC-Q200 |
Depth | 0.5mm |
Height | 0.5mm |
Series | CGA |
Suppression Class | Class 2 |
Maximum Operating Temperature | +150°C |
Minimum Operating Temperature | -55°C |