- RS-artikelnummer:
- 750-0908
- Tillverkare / varumärke:
- RS PRO
Tillfälligt slut i lager – restorder för leverans 2024-04-02
Pris (ex. moms) Var (i en påse med 5)
29,988 kr
(exkl. moms)
37,485 kr
(inkl. moms)
Enheter | Per unit | Per Bag* |
5 - 45 | 29,988 kr | 149,94 kr |
50 - 120 | 27,568 kr | 137,84 kr |
125 - 245 | 26,388 kr | 131,94 kr |
250 - 495 | 25,49 kr | 127,45 kr |
500 + | 23,412 kr | 117,06 kr |
Alternativ
Denna produkt är för närvarande inte tillgänglig. Vi rekommenderar denna produkt istället.
- RS-artikelnummer
- 750-0904
Pris (ex. moms) Var (i en påse med 5)
33,988 kr
(exkl. moms)
42,485 kr
(inkl. moms)
- RS-artikelnummer:
- 750-0908
- Tillverkare / varumärke:
- RS PRO
Datablad
Lagstiftning och ursprungsland
- COO (Country of Origin):
- GB
Produktdetaljer
BGA Heatsink, Standard
Standard type BGA heatsink suitable for a variety of applications.
RS PRO Heatsink - Adhesive Foil, 20 mm x 20 mm x 19.1 mm
The RS PRO standard BGA (Ball Grid Array) Push Pin heatsink is meticulously designed for superior performance and precision, seamlessly integrating into your electronic systems. This heatsink serves as a crucial element in preventing circuits from overheating, thereby ensuring the consistent and reliable performance of your electronic devices.
Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.
Why Would You Choose This Heatsink?
The RS PRO Heatsink plays a vital role in maintaining optimal operating temperatures for your electronic components, safeguarding them against the risks of overheating. As electronic components generate heat during operation, the heatsink effectively absorbs and dissipates this heat, preventing the accumulation that could otherwise lead to damage or a decline in component performance. Invest in the RS PRO Heatsink for enhanced thermal management and prolonged durability of your electronic devices.
Features and Benefits
- BGA heatsink
- Standard, Pushpin
- Made from aluminium
- Adhesive foil mounting
- Anodized finish
- For use with Universal rectangular Alu
- Thermal resistance 14.0° C/W
Dimensions
- 20 mm x 20 mm x 19.1mm
Applications
- Integrated Circuits
- PCB
BGA Heatsinks
Specifikationer
Attribute | Value |
---|---|
For Use With | Universal Rectangular Alu |
Length | 20mm |
Width | 20mm |
Height | 19.1mm |
Dimensions | 20 x 20 x 19.1mm |
Thermal Resistance | 14K/W |
Mounting | Adhesive Foil |
Colour | Black |
Application | Semiconductor Devices |
Material | Aluminium |
Package Type | BGA |
Finish | Anodized |