Laird Technologies Heatsink Transistor Mount Kit

Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical
contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of
240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied
in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut
to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive
coating is the thinnest available, minimizing any impact on thermal performance.