- RS-artikelnummer:
- 188-2663P
- Tillv. art.nr:
- W25X10CLSNIG
- Tillverkare / varumärke:
- Winbond
- RS-artikelnummer:
- 188-2663P
- Tillv. art.nr:
- W25X10CLSNIG
- Tillverkare / varumärke:
- Winbond
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Density 1Mbit Voltage 2.3 - 3.6V Speed 104MHZ Package SOIC8 150mil Package USON8 2x3mm.
Single/Dual SPI
UID
2.3V to 3.6V Vcc Range, Space Efficient Packaging
Flexible Architecture with 4KB Sectors
1mA Active Read Current, <1mA Power Down Current
UID
2.3V to 3.6V Vcc Range, Space Efficient Packaging
Flexible Architecture with 4KB Sectors
1mA Active Read Current, <1mA Power Down Current
Specifikationer
Attribute | Value |
---|---|
Memory Size | 1Mbit |
Interface Type | SPI |
Package Type | SOIC |
Pin Count | 8 |
Organisation | 128K x 8 bit |
Mounting Type | Surface Mount |
Cell Type | NOR |
Minimum Operating Supply Voltage | 2.3 V |
Maximum Operating Supply Voltage | 3.6 V |
Block Organisation | Symmetrical |
Length | 5mm |
Height | 1.5mm |
Width | 4mm |
Dimensions | 5 x 4 x 1.5mm |
Maximum Random Access Time | 8ns |
Series | W25X |
Number of Bits per Word | 8bit |
Number of Words | 128K |
Minimum Operating Temperature | -40 °C |
Maximum Operating Temperature | +85 °C |