Electronics Heating & Cooling Components
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Pris (Pris visas exkl. moms) | Beskrivning | Artikelinformation |
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Heatsink, For TGHE Series and SOT-227, 48.7 x 35.05 x 27.94mm, Panel
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Heatsink, BGA, CPU and GPU, 27 x 27 x 17.5mm, PCB Mount
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Arcol Ohmite Heatsink Clip for use with TO-247
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Heatsink, BGA, CPU and GPU, 45 x 45 x 12.5mm, PCB Mount
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Heatsink, TO263, 12 x 25 x 12mm
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Heatsink, TO263, 12 x 26 x 11.68mm
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Heatsink, For TGHE Series and SOT-227, 48.7 x 55 x 30mm, Panel
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Heatsink, BGA, CPU and GPU, 27 x 27 x 17.5mm, PCB Mount
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 127.7x72.5mm
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Heatsink, TO-247, TO-264 and SOT-227, 58 x 32 x 46.3mm
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Heatsink, TO-218, TO-220, TO-247, 42 x 25 x 25.4mm, Vertical
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Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 27 x 33.9 x 39.5mm
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 38.1mm, PCB Through Hole
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Heatsink, TO-218, TO-220, TO-247
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Heatsink, TO263, 12 x 25 x 12mm
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Heatsink, For TGHE Series and SOT-227, 48.7 x 55 x 30mm, Panel
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